Colaborare internațională UE și Japonia în domeniul semiconductorilor

Programul Europa digitală

Pe scurt

Banii sunt pentru proiecte de cercetare și inovare în semiconductori, axate pe integrare heterogenă avansată (ambalare 2.5D și 3D, fotonica integrata) si pe interfete standardizate de chiplet pentru interoperabilitate. Finantarea acopera activitati de la nivel de laborator pana la medii pilot, cu verificare in cazuri de utilizare din fabricatia de semiconductori, la nivele de maturitate tehnologica 5-7. Se adreseaza organizatiilor care lucreaza in industria semiconductorilor din statele eligibile ale Programului Europa digitala.

Grant per proiect

3.000.000 la 5.000.000 EUR

Buget total apel

5.000.000 EUR

Se deschide

07.07.2026

Tip de acțiune

DIGITAL JU Simple Grants

Eligibilitate România

Organizațiile din România pot aplica

Identificator apel

DIGITAL-JU-CHIPS-2026-SG-JAPAN

Sursă

Portalul UE pentru finanțări (apeluri tematice)

Expected Outcome:Projects are expected to contribute to the following expected outcomes: Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities. Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem Expected outcomes should have direct and immediate impact on European industry.Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.

Conditions1. Admissibility conditions: Proposal page limit and layoutdescribed in Appendix 8 of Work Programme - Chips for Europe Initiative call document.Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.2. Eligible countriesdescribed in Appendix 8 of Work Programme - Chips for Europe Initiative.3. Other eligibility conditionsAppendix 8 of Work Programme - Chips for Europe Initiative.4. Financial and operational capacity and exclusiondescribed Appendix 8 of Work Programme - Chips for Europe Initiative.5a. Evaluation and award: Submission and evaluation processesdescribed Appendix 8 of Work Programme - Chips for Europe Initiative and the Online Manual.5b. Evaluation and award: Award criteria, scoring and thresholdsdescribed Appendix 8 of Work Programme - Chips for Europe Initiative.5c. Evaluation and award: Indicative timeline for evaluation and grant agreementdescribed in Appendix 8 of Work Programme - Chips for Europe Initiative.6. Legal and financial set-up of the grantsdescribed Appendix 8 of Work Programme - Chips for Europe Initiative.Call DetailsCall document and annexes: Model Grant Agreements (MGA)DEP MGAAdditional documents: DEP Regulation 2021/964EU Financial Regulation 2024/2509EU Grants AGA, Annotated Model Grant Agreement Funding & Tenders Portal Online Manual Funding & Tenders Portal Terms and Conditions Funding & Tenders Portal Privacy Statement

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Apelul oficial

Condițiile din ghidul oficial sunt singurele care contează la depunere.

Program